Article number: |
SPSE10 |
Availability: |
Out of stock |
Ideal for soldering small and delicate joins that are at risk of melting with repeated or prolonged exposure to heat. The paste combines solder (65%) with a flux/binder (35%), ensuring that you don’t under- or overflux and eliminates the need to heat the join twice.
- Metal type : Silver
- Solidus temperature : 1,240°F (693°C)
- Liquidus temperature : 1,325°F (718°C)
- Density : 650 easy
- Country of origin : United States
- Melt temperature : 1,240°F (693°C)